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Integrated circuit packaging
Results: 80

#	Item
61	3D Systems Packaging Research Center Glass and Silicon Packages AN INDUSTRY-ACADEMIA CONSORTIUM Add to Reading List Source URL: www.prc.gatech.edu Language: English - Date: 2013-04-29 07:49:13 Microtechnology Three-dimensional integrated circuit Silicon Polycrystalline silicon Wafer Chemistry Semiconductor device fabrication Matter
62	VIVEK SRIDHARAN 511 Lynch Ave NW . Atlanta GA 30318 Add to Reading List Source URL: www.prc.gatech.edu Language: English - Date: 2013-04-29 07:48:19 Electromagnetism Three-dimensional integrated circuit Integrated circuit Microelectromechanical systems Microwave Reliability Packaging and labeling Technology Semiconductor device fabrication Electronic engineering
63	Georgia Tech’s Vision for Ultra-miniaturized Device and Systems Packaging Encompassing R&D, Inter-disciplinary Education and Global Collaborations By Rao R. Tummala, Venky Sundaram, P. M. Raj, Raghu Pucha, Tapo Bandyop Add to Reading List Source URL: www.prc.gatech.edu Language: English - Date: 2013-04-29 07:48:12 Materials science Microtechnology Electronic design Industrial design Semiconductor device fabrication Integrated circuit Three-dimensional integrated circuit Microelectromechanical systems Transistor Technology Semiconductor devices Electromagnetism
64	3D Systems Packaging Research Center Glass and Silicon Packages AN INDUSTRY-ACADEMIA CONSORTIUM Add to Reading List Source URL: www.prc.gatech.edu Language: English - Date: 2013-04-29 07:49:06 Microtechnology Three-dimensional integrated circuit Silicon Polycrystalline silicon Wafer Chemistry Semiconductor device fabrication Matter
65	3D Systems Packaging Research Center AN INDUSTRY-ACADEMIA CONSORTIUM Chip-Last Embedded MEMS, Actives and Passives With Chip-First Benefits Add to Reading List Source URL: www.prc.gatech.edu Language: English - Date: 2013-04-29 07:49:05 Microtechnology Semiconductor device fabrication Integrated circuits Three-dimensional integrated circuit Microelectromechanical systems Materials science Electromagnetism Technology
66	Brokerage H2020 Call ICT2 – 2014 Partner Presentation: NANIUM S.A[removed]Partner and contact person: NANIUM S.A., Vila do Conde, Porto, Portugal Steffen Kröhnert, Director of Technology Expertise and Activities: Add to Reading List Source URL: ec.europa.eu Language: English - Date: 2014-03-10 05:00:00 Technology Embedded Wafer Level Ball Grid Array Three-dimensional integrated circuit Qimonda Integrated circuit packaging Wafer-level packaging Semiconductor device fabrication Electronics Microtechnology
67	Project result CT302 I Towards one European test solution [TOETS] A testing dilemma As semiconductor chip Add to Reading List Source URL: www.catrene.org Language: English - Date: 2014-07-07 11:34:38 Integrated circuits Design for X Semiconductor device fabrication Packaging Reliability engineering Survival analysis Built-in self-test Application-specific integrated circuit NXP Semiconductors Technology Electronic engineering Design
68	GOLD SPONSOR SHOWS HIGHLIGHTS The largest-class global comprehensive trade shows, including JPCA Show 2014, of the electronic circuits industry, surrounding the theme of “Mount, Connect, Manufacture, and Expand” and Add to Reading List Source URL: www.jpcashow.com Language: English - Date: 2014-06-12 20:19:00 Japan Robot Association Integrated circuit packaging Electronic engineering Technology Consumer Electronics Show Trade fair Electronics
69	Brokerage H2020 Call ICT2 – 2014 Partner Presentation: NANIUM S.A[removed]Partner and contact person: NANIUM S.A., Vila do Conde, Porto, Portugal Steffen Kröhnert, Director of Technology Expertise and Activities: Add to Reading List Source URL: ec.europa.eu Language: English - Date: 2014-03-10 05:00:00 Technology Embedded Wafer Level Ball Grid Array Three-dimensional integrated circuit Qimonda Integrated circuit packaging Wafer-level packaging Semiconductor device fabrication Electronics Microtechnology
70	Inter-Seal® Bonding System Market Applications: • Chromatography • Environmental (water and soil sampling) • Diagnostic packaging • Pharmaceutical packaging Add to Reading List Source URL: www.iltusa.com Language: English - Date: 2012-02-06 15:47:12 Containers Integrated circuit packaging Adhesive Bond Technology Semiconductor device fabrication Closure

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